Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US12842481Application Date: 2010-07-23
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Publication No.: US08434884B2Publication Date: 2013-05-07
- Inventor: Chi-Feng Chiu , Yeh-En Chien
- Applicant: Chi-Feng Chiu , Yeh-En Chien
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corp.
- Current Assignee: Au Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Priority: CN200910160812 20090724; CN201010235092 20100723
- Main IPC: G09F13/04
- IPC: G09F13/04 ; G09F13/08 ; F21V23/00

Abstract:
An exemplary backlight module is disclosed in the present invention. The backlight module includes a light source module, a main circuit board, a flexible printed circuit board and a bracket. The bracket is made of a conductive material and used for fixing the light source module. The light source module includes at least a light source circuit substrate and a plurality of light sources disposed on the at least a light source circuit substrate. The light source circuit substrate includes a plurality of grounding pads. A part of the grounding pads are electrically contacted to the bracket. The main circuit board includes a grounding terminal. The grounding terminal is electrically connected to another part of the grounding pads through the flexible printed circuit board. The backlight module facilitate the static electricity on the light source module to be grounded, and avoids the light source module being damaged by electro-static discharge.
Public/Granted literature
- US20110019389A1 Backlight Module Public/Granted day:2011-01-27
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