Invention Grant
- Patent Title: Apparatus for fracturing polycrystalline silicon and method for producing fractured fragments of polycrystalline silicon
- Patent Title (中): 破碎多晶硅的装置及多晶硅断裂碎片的制造方法
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Application No.: US13282620Application Date: 2011-10-27
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Publication No.: US08434707B2Publication Date: 2013-05-07
- Inventor: Ryusuke Tada , Takahiro Matsuzaki , Shunsuke Kotaki , Motoki Sato
- Applicant: Ryusuke Tada , Takahiro Matsuzaki , Shunsuke Kotaki , Motoki Sato
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Materials Corporation
- Current Assignee: Mitsubishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2010-242061 20101028
- Main IPC: B02C13/20
- IPC: B02C13/20 ; B02C13/09

Abstract:
An apparatus for fracturing polycrystalline silicon having: a pair of rolls rotated in a counter direction each other around parallel axes; and a plurality of fracturing teeth units provided on outer peripheral surfaces of the rolls, arranged along a circumferential direction of the rolls, and have a plurality of fracturing teeth and fixing covers fixing the fracturing teeth on the outer peripheral surfaces of the rolls, in which: the fracturing teeth has flanges; and the fixing covers are formed as strips along a longitudinal direction of the rolls, and in which the fixing covers are fixed on the rolls in a state in which top ends of the fracturing teeth are protruded outward radially of the rolls from the fixing hole outward so as to hold the flanges between the fixing covers and the rolls.
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