Invention Grant
- Patent Title: Method for manufacturing a substrate supporting an integrated circuit chip
- Patent Title (中): 制造支撑集成电路芯片的基板的方法
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Application No.: US13487435Application Date: 2012-06-04
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Publication No.: US08434223B2Publication Date: 2013-05-07
- Inventor: Martin John McCaslin , Szu-Han Hu , Alex Enriquez Cayaban , Voon Yee Ho
- Applicant: Martin John McCaslin , Szu-Han Hu , Alex Enriquez Cayaban , Voon Yee Ho
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Main IPC: H01R43/00
- IPC: H01R43/00
Abstract:
A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
Public/Granted literature
- US20120238072A1 HEAT TRANSFER FOR A HARD-DRIVE PRE-AMP Public/Granted day:2012-09-20
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