Invention Grant
- Patent Title: Mounting apparatus for circuit board
- Patent Title (中): 电路板安装装置
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Application No.: US13231143Application Date: 2011-09-13
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Publication No.: US08434217B2Publication Date: 2013-05-07
- Inventor: Po-Wen Chiu , Wen-Hu Lu , Zhan-Yang Li
- Applicant: Po-Wen Chiu , Wen-Hu Lu , Zhan-Yang Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110142246 20110530
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A mounting apparatus includes a bottom panel, a first mounting member, and a second mounting member. The bottom panel includes a top surface and a bottom surface. The first mounting member includes a positioning portion and an installation portion. A concave portion is defined in the bottom surface, for receiving and preventing the positioning portion from rotating relative to the bottom panel. The bottom panel defines a through hole, for an installation portion. The second mounting member includes a locking portion. The locking portion defines an installation hole, for locking the installation portion. The bottom panel top surface t is between locking portion and positioning portion. The positioning portion bottom surface place in the same plane with the bottom panel bottom surface or is between the bottom panel top surface and the bottom panel bottom surface.
Public/Granted literature
- US20120304457A1 MOUNTING APPARATUS FOR CIRCUIT BOARD Public/Granted day:2012-12-06
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