An embodiment of a multichip module is disclosed. For this embodiment of the multichip module, a transceiver die has transceivers. A crossbar switch die has at least one crossbar switch. A protocol logic blocks die has protocol logic blocks. The transceiver die, the crossbar switch die, and the protocol logic blocks die are all coupled to an interposer. The interposer interconnects the transceivers and the protocol logic blocks to one another and interconnects the protocol logic blocks and the at least one crossbar switch to one another.