Invention Grant
- Patent Title: Hearing aid housing
- Patent Title (中): 助听器房屋
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Application No.: US12936230Application Date: 2008-04-02
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Publication No.: US08416975B2Publication Date: 2013-04-09
- Inventor: Wai Kit David Ho , Wee Haw Koo
- Applicant: Wai Kit David Ho , Wee Haw Koo
- Applicant Address: SG Singapore
- Assignee: Siemens Medical Instruments Pte. Ltd.
- Current Assignee: Siemens Medical Instruments Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- International Application: PCT/SG2008/000107 WO 20080402
- International Announcement: WO2009/123563 WO 20091008
- Main IPC: H04R25/00
- IPC: H04R25/00
Abstract:
In an embodiment, a hearing aid housing is provided. The hearing aid housing may include a first behind-the-ear hearing aid housing portion, a second behind-the-ear hearing aid housing portion, and a moisture protector at least partially arranged between the first behind-the-ear hearing aid housing portion and the second behind-the-ear hearing aid housing portion.
Public/Granted literature
- US20110222716A1 HEARING AID HOUSING Public/Granted day:2011-09-15
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