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Invention Grant
US08416579B2 Electronic assembly for attachment to a fabric substrate, electronic textile, and method of manufacturing such an electronic textile 有权
用于连接到织物基底的电子组件，电子织物以及制造这种电子织物的方法

Electronic assembly for attachment to a fabric substrate, electronic textile, and method of manufacturing such an electronic textile
Abstract:
An electronic assembly (20; 30; 40; 50) for attachment to a fabric substrate (60; 82, 102) having a conductor pattern (62a-b; 85a-b; 107a-c) on a first side (63; 86; 108) thereof. The electronic assembly comprises an electronic device (23; 42; 64), and at least a first clamping member (21; 41; 65). The electronic assembly is, furthermore, adapted to clamp the electronic device (23; 42; 64) to the first side (63; 86; 108) of the fabric substrate (60; 82, 102) in such a way that the electronic device (23; 42; 64) is electrically connected to the conductor pattern (62a-b; 85a-b; 107a-c).
Abstract(Chinese):

一个电子组件（20; 30; 40; 50），用于连接到在第一侧（63; 86）上具有导体图案（62a-b; 85a-b; 107a-c）的织物衬底（60; ; 108）。 电子组件包括电子设备（23; 42; 64）和至少第一夹紧构件（21; 41; 65）。 此外，电子组件适于将电子设备（23; 42; 64）夹紧到织物基底（60; 82,102）的第一侧（63; 86; 108）上，使得电子设备 （23; 42; 64）电连接到导体图案（62a-b; 85a-b; 107a-c）。

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