Invention Grant
- Patent Title: Power supply assembly
- Patent Title (中): 电源总成
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Application No.: US12907095Application Date: 2010-10-19
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Publication No.: US08416569B2Publication Date: 2013-04-09
- Inventor: Yun-Lung Chen , Chung Chai , Yu-Gui Chen
- Applicant: Yun-Lung Chen , Chung Chai , Yu-Gui Chen
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010198955 20100611
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/00

Abstract:
A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply unit, and a positioning element. The enclosure body includes a bottom panel, a rear panel, and a side panel. The power supply unit is mounted in the enclosure body and is prevented from moving in a first direction substantially perpendicular to the rear panel and a second direction substantially perpendicular to the side panel. The positioning element includes a plate body, a first positioning portion, and a second positioning portion. The power supply unit is sandwiched between the bottom panel and the plate body. The first positioning portion is for preventing the power supply unit from moving along a first direction substantially parallel to the bottom panel. The second positioning portion for preventing the power supply unit from moving along a second direction parallel to the bottom panel.
Public/Granted literature
- US20110304986A1 POWER SUPPLY ASSEMBLY Public/Granted day:2011-12-15
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