Invention Grant
- Patent Title: Power amplifier module with shared ESD protection circuit
- Patent Title (中): 功率放大器模块,具有共享ESD保护电路
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Application No.: US13177001Application Date: 2011-07-06
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Publication No.: US08416545B2Publication Date: 2013-04-09
- Inventor: Ki Joong Kim , Youn Suk Kim , Dae Seok Jang , Young Jean Song , Jun Goo Won
- Applicant: Ki Joong Kim , Youn Suk Kim , Dae Seok Jang , Young Jean Song , Jun Goo Won
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0080535 20100819
- Main IPC: H02H9/00
- IPC: H02H9/00

Abstract:
Disclosed is a power amplifier module with a shared ESD protection circuit. There is provided a power amplifier module including: an ESD protection circuit that is connected to an output terminal of the LDO part, an output conductive wire pad that outputs the operating power of the LDO part; a printed conductive wire pad that is electrically connected to the output conductive wire pad of the PA controller; a first power coupler that includes a first primary side conductive wire electrically connected to the printer conductive wire pad; a second power coupler that includes a second primary side conductive wire electrically connected to the printer conductive wire pad; a first PA part; and a second PA part, wherein each of the first PA part and the second PA part is protected from ESD by the ESD protection circuit.
Public/Granted literature
- US20120044604A1 POWER AMPLIFIER MODULE WITH SHARED ESD PROTECTION CIRCUIT Public/Granted day:2012-02-23
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