An electrowetting device includes: a substrate having a non-hydrophobic insulating layer; a surrounding wall formed on an upper surface of the insulating layer; a microchamber surrounded by an inner surface of the surrounding wall and formed over the upper surface of the insulating layer; a hydrophobic coating layer that is applied to the inner surface of the surrounding wall and the upper surface of the insulating layer and that covers a seam between the inner surface and the upper surface; and a liquid disposed in the microchamber and on the hydrophobic coating layer.