Invention Grant
- Patent Title: Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device
- Patent Title (中): 声表面波装置及其调谐方法
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Application No.: US10822731Application Date: 2004-04-13
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Publication No.: US08416038B2Publication Date: 2013-04-09
- Inventor: Kenichi Anasako
- Applicant: Kenichi Anasako
- Applicant Address: US NV Las Vegas
- Assignee: Intellectual Ventures Fund 77 LLC
- Current Assignee: Intellectual Ventures Fund 77 LLC
- Current Assignee Address: US NV Las Vegas
- Agency: Turocy & Watson, LLP
- Priority: JP2003-111296 20030416
- Main IPC: H03H9/64
- IPC: H03H9/64
Abstract:
A surface acoustic wave device comprises a piezoelectric substrate (1), at least one inter-digital transducers (IDT) (2) provided on the piezoelectric substrate, at least one elongated electrode pad (4) electrically connected to the IDT, and at least one stud bump (5) disposed on the electrode pad such that an LC component of the surface acoustic wave device has a predetermined value.
Public/Granted literature
- US20050225410A1 Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device Public/Granted day:2005-10-13
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