Invention Grant
- Patent Title: Transmission noise suppressing structure and wiring circuit board
- Patent Title (中): 传输噪声抑制结构和布线电路板
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Application No.: US12671304Application Date: 2008-08-01
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Publication No.: US08416029B2Publication Date: 2013-04-09
- Inventor: Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
- Applicant: Toshiyuki Kawaguchi , Kazutoki Tahara , Tsutomu Saga
- Applicant Address: JP
- Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2007-202121 20070802; JP2007-277769 20071025
- International Application: PCT/JP2008/063899 WO 20080801
- International Announcement: WO2009/017232 WO 20090205
- Main IPC: H04B3/28
- IPC: H04B3/28 ; H01P3/08

Abstract:
The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.
Public/Granted literature
- US20100201459A1 TRANSMISSION NOISE SUPPRESSING STRUCTURE AND WIRING CIRCUIT BOARD Public/Granted day:2010-08-12
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