A semiconductor package includes an IC chip including a pad array having at least four pads, the pads including a voltage input pad and a voltage output pad disposed at edges of the pad array, a driver transistor disposed between the voltage input pad and the voltage output pad to receive an input voltage from the voltage input pad and output an output voltage to the voltage output pad, disposed in contact with an outer edge of the element arrangement region; and at least four leads on which the IC chip is mounted by flip chip bonding, disposed corresponding to the pads, formed in a lead array, the leads including a voltage input lead electrically connected to the voltage input pad and a voltage output lead electrically connected to the voltage output pad, disposed at edges of the lead array.