Invention Grant
- Patent Title: Light emitting element, method for manufacturing same, and light emitting device
- Patent Title (中): 发光元件及其制造方法以及发光元件
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Application No.: US12886468Application Date: 2010-09-20
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Publication No.: US08415697B2Publication Date: 2013-04-09
- Inventor: Chisato Furukawa
- Applicant: Chisato Furukawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2010-030931 20100216
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00
Abstract:
According to one embodiment, a light emitting element includes a semiconductor stacked body and a translucent substrate. The semiconductor stacked body includes a light emitting layer. The translucent substrate has one surface and a side surface. The semiconductor stacked body is provided on the upper surface. An unevenness uniformly distributing with average height and average pitch is provided on the side surface.
Public/Granted literature
- US20110198665A1 LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME, AND LIGHT EMITTING DEVICE Public/Granted day:2011-08-18
Information query
IPC分类:
