Invention Grant
- Patent Title: Method of contact coating a microneedle array
- Patent Title (中): 接触涂布微针阵列的方法
-
Application No.: US13290610Application Date: 2011-11-07
-
Publication No.: US08414959B2Publication Date: 2013-04-09
- Inventor: Choi Hye-Ok , Gordon P. Knutson , Moses M. David
- Applicant: Choi Hye-Ok , Gordon P. Knutson , Moses M. David
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Main IPC: A61M3/00
- IPC: A61M3/00 ; A61M37/00 ; A61M5/32 ; B05C1/00 ; B05C1/14

Abstract:
A method of coating a microneedle array by applying a coating fluid using a flexible film in a brush-like manner. A method of coating a microneedle array comprising: providing a microneedle array having a substrate and a plurality of microneedles; providing a flexible film; providing a coating solution comprising a carrier fluid and a coating material; applying the coating solution onto a first major surface of the flexible film; performing a transfer step of bringing the first major surface of the flexible film into contact with the microneedles and removing the flexible film from contact with the microneedles; and allowing the carrier fluid to evaporate.
Public/Granted literature
- US20120114857A1 METHOD OF CONTACT COATING A MICRONEEDLE ARRAY Public/Granted day:2012-05-10
Information query