Invention Grant
US08412962B2 Microprocessor with improved thermal monitoring and protection mechanism
有权
具有改进的热监测和保护机制的微处理器
- Patent Title: Microprocessor with improved thermal monitoring and protection mechanism
- Patent Title (中): 具有改进的热监测和保护机制的微处理器
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Application No.: US12873549Application Date: 2010-09-01
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Publication No.: US08412962B2Publication Date: 2013-04-02
- Inventor: Darius D. Gaskins , Charles John Holthaus
- Applicant: Darius D. Gaskins , Charles John Holthaus
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agent E. Alan Davis; James W. Huffman
- Main IPC: G06F1/00
- IPC: G06F1/00

Abstract:
A microprocessor including a temperature sensor that monitors a temperature of core logic of the microprocessor during operation thereof, and operating point information from which may be determined N operating points at which the microprocessor core may reliably operate at a first temperature. Each of the N operating points has a different combination of operating frequency and voltage. The N operating points comprise a highest operating point, a lowest operating point, and a plurality of operating points intermediate the highest and lowest operating points. The microprocessor also includes a control circuit that transitions operation of the core logic among the N operating points to attempt to keep the operating temperature of the core logic provided by the temperature sensor within a temperature range whose upper bound is the first temperature.
Public/Granted literature
- US20100324750A1 MICROPROCESSOR WITH IMPROVED THERMAL MONITORING AND PROTECTION MECHANISM Public/Granted day:2010-12-23
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