This disclosure is directed to an implantable medical device having a housing that encloses at least a communication module. The implantable medical device also includes a first electrode electrically coupled to the communication module and an electrically conductive fixation mechanism that is mechanically coupled to the housing and electrically coupled to the communication module within the housing. The electrically conductive fixation mechanism includes a dielectric material that covers part of a surface of the fixation mechanism. A portion of the electrically conductive fixation mechanism is not covered by the dielectric material such that the portion of the electrically conductive fixation mechanism is exposed to form a second electrode that is electrically coupled to the communication module. The communication module is configured to communicate using the first electrode and second electrode.