Invention Grant
- Patent Title: Interposer-on-glass package structures
- Patent Title (中): 内置玻璃封装结构
-
Application No.: US12834943Application Date: 2010-07-13
-
Publication No.: US08411459B2Publication Date: 2013-04-02
- Inventor: Chen-Hua Yu , Jing-Cheng Lin
- Applicant: Chen-Hua Yu , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/16
Abstract:
A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.
Public/Granted literature
- US20110304999A1 Interposer-on-Glass Package Structures Public/Granted day:2011-12-15
Information query
