Invention Grant
- Patent Title: Heat sink assembly container
- Patent Title (中): 散热器组装容器
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Application No.: US12912390Application Date: 2010-10-26
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Publication No.: US08411436B2Publication Date: 2013-04-02
- Inventor: Chi-Wen Chou
- Applicant: Chi-Wen Chou
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat sink assembly is packaged by placing the heat sink assembly in a container. The container is secured within a hard disk drive cage.
Public/Granted literature
- US20120097363A1 HEAT SINK ASSEMBLY CONTAINER Public/Granted day:2012-04-26
Information query
