Invention Grant
- Patent Title: Overload relay switch without springs
- Patent Title (中): 过载继电器开关无弹簧
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Application No.: US13165001Application Date: 2011-06-21
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Publication No.: US08410875B2Publication Date: 2013-04-02
- Inventor: Daniel Patrick Heckenkamp
- Applicant: Daniel Patrick Heckenkamp
- Applicant Address: US OH Cleveland
- Assignee: Eaton Corporation
- Current Assignee: Eaton Corporation
- Current Assignee Address: US OH Cleveland
- Agency: Eckert Seamans Cherin & Mellott, LLC
- Agent David C. Jenkins
- Main IPC: H01H73/00
- IPC: H01H73/00 ; H01H75/00

Abstract:
The disclosed concept relates to an overload relay and, more specifically, to an overload relay switch having a reduced number of components and less complex components. The reduced number of components includes the lack of a return spring on the manual actuators. Further, the relay switch member, which was typically a snap switch conducting member structured to change its configuration, is a substantially flat blade. Further, a circuit is used to detect an over-current condition and a solenoid actuates the relay switch assembly, thereby eliminating the need for a mechanical over-current detection and switch actuation device.
Public/Granted literature
- US20120001707A1 OVERLOAD RELAY SWITCH WITHOUT SPRINGS Public/Granted day:2012-01-05
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