Multiple pads are provided to a semiconductor chip of a semiconductor device. A first pad is arranged on a path for a first signal set to a voltage that corresponds to a first level in the active state. The first signal is input to the semiconductor chip from outside the semiconductor device, or is output to outside the semiconductor device from the semiconductor chip. A second pad is provided in order to receive a setting voltage. A first pin is connected to a first pad via a connection member, and receives the first signal from outside the semiconductor device, or from the semiconductor chip via the first pad. A second pin receives, from outside, a second signal set to a voltage that corresponds to the first level or a second level which is the complement of the first level.