Invention Grant
- Patent Title: Semiconductor device with chip mounted on a substrate
- Patent Title (中): 具有芯片的半导体器件安装在基板上
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Application No.: US11966960Application Date: 2007-12-28
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Publication No.: US08410595B2Publication Date: 2013-04-02
- Inventor: Steffen Kroehnert , Kerstin Nocke , Juergen Grafe , Kashi Vishwanath Machani
- Applicant: Steffen Kroehnert , Kerstin Nocke , Juergen Grafe , Kashi Vishwanath Machani
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agent John S. Economou
- Priority: DE102006062473 20061228
- Main IPC: H01L23/055
- IPC: H01L23/055
Abstract:
A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.
Public/Granted literature
- US20080157330A1 Semiconductor Device with Chip Mounted on a Substrate Public/Granted day:2008-07-03
Information query
IPC分类:
