Invention Grant
US08410593B2 Process and system for manufacturing an encapsulated semiconductor device
有权
用于制造封装的半导体器件的工艺和系统
- Patent Title: Process and system for manufacturing an encapsulated semiconductor device
- Patent Title (中): 用于制造封装的半导体器件的工艺和系统
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Application No.: US12717967Application Date: 2010-03-05
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Publication No.: US08410593B2Publication Date: 2013-04-02
- Inventor: Agatino Minotti
- Applicant: Agatino Minotti
- Applicant Address: IT Agrate Brianza (MI)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MI)
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: ITTO2007A0489 20070705
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A process for manufacturing a semiconductor device envisages the steps of: positioning a frame structure, provided with a supporting plate carrying a die of semiconductor material, within a molding cavity of a mold; and introducing encapsulating material within the molding cavity for the formation of a package, designed to encapsulate the die. The frame structure is further provided with a prolongation element mechanically coupled to the supporting plate inside the molding cavity and coming out of the molding cavity, and the process further envisages the steps of: controlling positioning of the supporting plate within the molding cavity with the aid of the prolongation element; and, during the step of introducing encapsulating material, separating and moving the prolongation element away from the supporting plate.
Public/Granted literature
- US20100159057A1 PROCESS AND SYSTEM FOR MANUFACTURING AN ENCAPSULATED SEMICONDUCTOR DEVICE Public/Granted day:2010-06-24
Information query
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