Invention Grant
- Patent Title: Ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions
- Patent Title (中): 离子注入装置和通过注入硼氢化物簇离子进行半导体制造的方法
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Application No.: US13102321Application Date: 2011-05-06
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Publication No.: US08410459B2Publication Date: 2013-04-02
- Inventor: Thomas N. Horsky , Dale C. Jacobson
- Applicant: Thomas N. Horsky , Dale C. Jacobson
- Applicant Address: US MA North Billerica
- Assignee: SemEquip, Inc.
- Current Assignee: SemEquip, Inc.
- Current Assignee Address: US MA North Billerica
- Agency: Katten Muchin & Rosenman LLP
- Agent John S. Paniaguas
- Main IPC: G21K5/10
- IPC: G21K5/10 ; H01J37/08 ; H01J49/30

Abstract:
An ion implantation device and a method of manufacturing a semiconductor device is described, wherein ionized boron hydride molecular clusters are implanted to form P-type transistor structures. For example, in the fabrication of Complementary Metal-Oxide Semiconductor (CMOS) devices, the clusters are implanted to provide P-type doping for Source and Drain structures and for Polygates; these doping steps are critical to the formation of PMOS transistors. The molecular cluster ions have the chemical form BnHx+ and BnHx−, where 10≦n≦100 and 0≦x≦n+4.
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