Invention Grant
- Patent Title: Wiring board and method of manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US12245025Application Date: 2008-10-03
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Publication No.: US08410375B2Publication Date: 2013-04-02
- Inventor: Yoshitaka Matsushita , Kazuhiro Oshima , Akio Horiuchi
- Applicant: Yoshitaka Matsushita , Kazuhiro Oshima , Akio Horiuchi
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2007-261850 20071005
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11 ; H05K1/00 ; H05K1/14
Abstract:
A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.
Public/Granted literature
- US20090095518A1 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-04-16
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