A touch pad including a printed circuit board, a plurality of column-conductor groups and a plurality of row-column groups. The printed circuit board is formed with an upper surface and a lower surface. The column-conductor groups include a plurality of first column-conductors and a plurality of second column-conductors. The row-conductor groups include a plurality of first row-conductors and a plurality of second row-conductors. The first column-conductors and the first row-conductors are provided on the upper surface. The second column-conductors and the second row-conductors are respectively provided on one and the other of the upper surface and the lower surface, and electrically connected to each other through column-vias and row-vias. Whereby the structure, the existing material and process can be still be used, and the problem of crossed wires can be avoided, also the yield of products can be increased with less waste of materials.