Invention Grant
US08409991B2 Method for manufacturing large-area vacuum plasma treated substrates and vacuum plasma treatment apparatus
有权
制造大面积真空等离子体处理基板和真空等离子体处理装置的方法
- Patent Title: Method for manufacturing large-area vacuum plasma treated substrates and vacuum plasma treatment apparatus
- Patent Title (中): 制造大面积真空等离子体处理基板和真空等离子体处理装置的方法
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Application No.: US12808192Application Date: 2008-12-19
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Publication No.: US08409991B2Publication Date: 2013-04-02
- Inventor: Stephan Jost , Andreas Belinger
- Applicant: Stephan Jost , Andreas Belinger
- Applicant Address: CH Trubbach
- Assignee: Oerlikon Solar AG, Trubbach
- Current Assignee: Oerlikon Solar AG, Trubbach
- Current Assignee Address: CH Trubbach
- Agency: Pearne & Gordon LL
- International Application: PCT/EP2008/068020 WO 20081219
- International Announcement: WO2009/080751 WO 20090702
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461
Abstract:
A large surface substrate (5, 5a) is Rf vacuum plasma treated with the help of an electrode arrangement (9) consisting of an even number of electrode strips (9a, 9b). At least one of the strips is Rf supplied at least two distinct loci (P1, P2) along the central axis (A) of the addressed strip (9a).
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