Invention Grant
- Patent Title: Method and apparatus for adhesive bond curing
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Application No.: US11638188Application Date: 2006-12-13
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Publication No.: US08409389B2Publication Date: 2013-04-02
- Inventor: Gary E. Jones
- Applicant: Gary E. Jones
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: B29C70/74
- IPC: B29C70/74

Abstract:
Portable apparatus for curing a part includes a wheeled frame having sliding part supports that move the part from a loading position to a curing position. A part clamping assembly is slidably mounted on the frame to apply clamping pressure to the part when the part is in the curing position in order to compact the part during a cure cycle. The clamping assembly includes a set of electrically heated shoes that heat the part to a cure temperature. A fan is provided to accelerate cool down the part after curing is complete. The heating and cooling operations are automatically performed by a programmed controller.
Public/Granted literature
- US20100224310A1 Method and apparatus for adhesive bond curing Public/Granted day:2010-09-09
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