Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US13046853Application Date: 2011-03-14
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Publication No.: US08408661B2Publication Date: 2013-04-02
- Inventor: Li-Ping Chen
- Applicant: Li-Ping Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010266517 20100830
- Main IPC: A47B81/00
- IPC: A47B81/00 ; H05K5/00

Abstract:
An electronic device enclosure includes a computer case, a mounting tray for receiving an expansion card and a fastening member. The computer case includes a front plate. A positioning slot and an opening are defined in the front plate. The fastening member includes a main body attached to the mounting tray and a latching plate connected to the main body. The latching plate is positioned in the positioning slot. An inserting portion is located on the latching plate and elastically engaged in the opening.
Public/Granted literature
- US20120049701A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2012-03-01
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