A method is provided for producing an arrangement, which, for example, may be used for further processing into a non-contact chip card or an identification document and which comprises a multi-layer structure, with a first part of an RFID antenna, at least comprising a coil-shaped antenna structure and a connecting structure, being arranged on a carrier layer and the chip being directly mounted on this part of the antenna structure and contacted, with a compensation layer being arranged thereabove, which in the area of the chip comprises an embedding opening and which comprises at least two contacting openings in the intersection area of the first part of the RFID antenna with a bridge structure, which is located on a cover layer, and subsequently the individual layers being connected to each other via lamination.