Invention Grant
- Patent Title: Method of enhancing fracture conductivity
- Patent Title (中): 提高断裂导电率的方法
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Application No.: US13491837Application Date: 2012-06-08
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Publication No.: US08408305B2Publication Date: 2013-04-02
- Inventor: Harold Dean Brannon , Brian N. Ward
- Applicant: Harold Dean Brannon , Brian N. Ward
- Applicant Address: US TX Houston
- Assignee: Baker Hughes Incorporated
- Current Assignee: Baker Hughes Incorporated
- Current Assignee Address: US TX Houston
- Agency: Jones & Smith LLP
- Agent John Wilson Jones
- Main IPC: E21B43/267
- IPC: E21B43/267

Abstract:
The method disclosed herein includes the introduction of proppant-free stage and a proppant laden stage into the wellbore and/or subterranean formation. The method increases the effective fracture width and enhances fracture conductivity within the formation. Either the proppant-free stage or the proppant laden stage contains a breaker. The other stage contains a viscosifying polymer or viscoelastic surfactant to which the breaker has affinity. The proppant-free stage may be introduced prior to introduction of the proppant laden stage into the wellbore and/or formation. Alternatively, the proppant laden stage may be introduced into the wellbore and/or formation prior to introduction of the proppant-free stage.
Public/Granted literature
- US20120241153A1 Method of Enhancing Fracture Conductivity Public/Granted day:2012-09-27
Information query
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