Invention Grant
- Patent Title: Vacuum relief
- Patent Title (中): 真空缓解
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Application No.: US11625032Application Date: 2007-01-19
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Publication No.: US08408129B2Publication Date: 2013-04-02
- Inventor: Geoffrey F. Schmid , Kevin T. Kersey
- Applicant: Geoffrey F. Schmid , Kevin T. Kersey
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41F1/40
- IPC: B41F1/40 ; B41F1/28 ; B41J2/01
Abstract:
A surface has a vacuum and a vacuum relief.
Public/Granted literature
- US20080174651A1 VACUUM RELIEF Public/Granted day:2008-07-24
Information query
