Invention Grant
- Patent Title: Lead wire implanting apparatus
- Patent Title (中): 铅线植入装置
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Application No.: US12988154Application Date: 2008-04-16
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Publication No.: US08407886B2Publication Date: 2013-04-02
- Inventor: Takashi Mitani , Masatoyo Okazaki
- Applicant: Takashi Mitani , Masatoyo Okazaki
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Totankako Co., Ltd.
- Current Assignee: Totankako Co., Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Westerman, Hattori, Daniels & Adrian LLP
- International Application: PCT/JP2008/057402 WO 20080416
- International Announcement: WO2009/128143 WO 20091022
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01R43/20

Abstract:
A lead wire implanting apparatus is provided that can fabricate high-quality brushes that are without variations in implanting height and implanting strength and free from cracks and that can make the reproducibility of set values better and improve the workability in setup changing. The lead wire implanting apparatus has a tamping member and a storing cup for storing conductive metal powder, for implanting and fixing a lead wire to a brush main body by performing a tamping action of the tamping member a predetermined number of times. The apparatus has a linear-type servo motor serving as a drive source for driving the tamping member in vertical directions, a first position detector for detecting a shift position of the tamping member, and a controller device for controlling the linear-type servo motor based on detected information by the first position detector to cause the tamping member to perform a predetermined tamping action.
Public/Granted literature
- US20110035931A1 LEAD WIRE IMPLANTING APPARATUS AND LEAD WIRE IMPLANTING METHOD Public/Granted day:2011-02-17
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