Invention Grant
- Patent Title: Printed circuit board layout device capable of automatically arranging encapsulated component and method thereof
- Patent Title (中): 能够自动排列封装成分的印刷电路板布局装置及其方法
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Application No.: US13095861Application Date: 2011-04-28
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Publication No.: US08407648B2Publication Date: 2013-03-26
- Inventor: Xiao-Cheng Sheng
- Applicant: Xiao-Cheng Sheng
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110025410 20110124
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A computer-implemented method for component arrangement in a PCB layout device is provided. The device includes wiring diagrams. First, generates a PCB encapsulation diagram corresponding to the selected wiring diagram. Then, obtains the coordinates of each electronic component in the selected wiring diagram. Next, generates a prompt to prompt the user to select a reference point in the PCB encapsulation diagram. Then, obtains the coordinates of the reference point. Next, determines an abscissa difference and an ordinate difference between one component in the wiring diagram and the reference point. Then, determines the coordinates of each encapsulated component in the PCB encapsulation diagram according to the abscissa difference, the ordinate difference, and the coordinates of each electronic component in the wiring diagram. And last, moves each encapsulated component to the determined corresponding coordinates of each encapsulated component in the PCB encapsulation diagram.
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