Invention Grant
- Patent Title: Housing for electronic device and method for making the same
- Patent Title (中): 电子设备外壳及其制造方法
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Application No.: US12813613Application Date: 2010-06-11
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Publication No.: US08406827B2Publication Date: 2013-03-26
- Inventor: Yue-Ping Liu , Hsiang-Jung Su , Wen-Te Lai , You-Li Liu
- Applicant: Yue-Ping Liu , Hsiang-Jung Su , Wen-Te Lai , You-Li Liu
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200910310134 20091120
- Main IPC: H04M1/00
- IPC: H04M1/00 ; B32B15/00
Abstract:
A housing for an electronic device is provided. The housing includes a substrate made of a light-transmittable ceramic. The substrate has an outer surface and an opposite inner surface defining at least one recess configured with patterns or symbols. An opaque layer is formed on the inner surface to prevent light penetrating through the substrate except through the at least one recess.
Public/Granted literature
- US20110120743A1 HOUSING FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME Public/Granted day:2011-05-26
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