Invention Grant
- Patent Title: Article including thermal interface element and method of preparation
- Patent Title (中): 文章包括热界面元素和制备方法
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Application No.: US12826337Application Date: 2010-06-29
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Publication No.: US08405996B2Publication Date: 2013-03-26
- Inventor: David Mulford Shaddock , Deng Tao , Hendrik Pieter Jacobus De Bock , Dalong Zhong , Christopher Michael Eastman , Kevin Matthew Durocher , Stanton Earl Weaver, Jr.
- Applicant: David Mulford Shaddock , Deng Tao , Hendrik Pieter Jacobus De Bock , Dalong Zhong , Christopher Michael Eastman , Kevin Matthew Durocher , Stanton Earl Weaver, Jr.
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Paul J. DiConza
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.
Public/Granted literature
- US20100328896A1 ARTICLE INCLUDING THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION Public/Granted day:2010-12-30
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