Invention Grant
US08405756B2 Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device 有权
光学元件,光学元件晶片,光学元件晶片模块,光学元件模块,光学元件模块的制造方法,电子元件晶片模块,电子元件模块的制造方法,电子元件模块和电子信息装置

  • Patent Title: Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
  • Patent Title (中): 光学元件,光学元件晶片,光学元件晶片模块,光学元件模块,光学元件模块的制造方法,电子元件晶片模块,电子元件模块的制造方法,电子元件模块和电子信息装置
  • Application No.: US12565444
    Application Date: 2009-09-23
  • Publication No.: US08405756B2
    Publication Date: 2013-03-26
  • Inventor: Yuji YanoNorimichi ShigemitsuKengo Iwai
  • Applicant: Yuji YanoNorimichi ShigemitsuKengo Iwai
  • Applicant Address: JP Osaka
  • Assignee: Sharp Kabushiki Kaisha
  • Current Assignee: Sharp Kabushiki Kaisha
  • Current Assignee Address: JP Osaka
  • Agency: Edwards Wildman Palmer LLP
  • Agent David G. Conlin; David A. Tucker
  • Priority: JP2008-246971 20080925; JP2009-199024 20090828
  • Main IPC: H04N5/225
  • IPC: H04N5/225
Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
Abstract:
An optical element according to the present invention includes: an optical surface at a center portion thereof; a spacer section having a predetermined thickness on an outer circumference side of the optical surface; a support plate including one or a plurality of through holes penetrating a portion corresponding to the optical surface, provided inside a transparent resin material, wherein the support plate has light shielding characteristics, an outer circumference portion side of the through hole of the support plate is provided inside the spacer section, and the outer circumference portion side of the through hole is configured to be thicker than a further outer circumference portion side thereof.
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