Invention Grant
- Patent Title: Apparatus for embedding wireless IC tags
- Patent Title (中): 用于嵌入无线IC标签的装置
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Application No.: US13376409Application Date: 2010-07-23
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Publication No.: US08405493B2Publication Date: 2013-03-26
- Inventor: Kikuo Kaga , Shigeo Ashizawa
- Applicant: Kikuo Kaga , Shigeo Ashizawa
- Applicant Address: JP Kanagawa
- Assignee: Mitomo Corporation
- Current Assignee: Mitomo Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-132489 20100609
- International Application: PCT/JP2010/062863 WO 20100723
- International Announcement: WO2011/155080 WO 20111215
- Main IPC: G06K7/01
- IPC: G06K7/01

Abstract:
The present invention provides an apparatus for embedding wireless IC tags in an object to be embedded with wireless IC tags. The apparatus for embedding wireless IC tags including: an alignment unit for aligning the wireless IC tags in the same direction by applying a vibrating force to the wireless IC tags; a distribution unit for distributing the wireless IC tags to a plurality of passages; a radio communication unit for performing, through radio communication, data writing and/or reading to/from the wireless IC tags; and a wireless IC tag embedding unit for embedding the wireless IC tags into an object to be embedded with wireless IC tags by applying air pressure to the wireless IC tags.
Public/Granted literature
- US20120098648A1 DATA PROCESSING AND CHARGING APPARATUS FOR WIRELESS IC TAGS Public/Granted day:2012-04-26
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