An elastic wave filter device includes first and second inductance elements included in a laminated substrate and first and second elastic wave filter chips mounted on the laminated substrate by flip-chip bonding. The first and second inductance elements provided in the laminated substrate include first and second coil patterns, respectively, which are provided in a plane located at a certain height level in the laminated substrate. The second coil pattern is arranged in a region in which the first coil pattern is provided.