Provided are a semiconductor device capable of reducing stress due to a density difference in the arrangement of bumps, and a method of manufacturing the semiconductor device. The semiconductor device includes: a wiring board including an electrode terminal group; a semiconductor chip including a bump formation surface where a bump group is formed and being mounted on the wiring board by using the bump group. The bump formation surface includes a first region where an area density of a region having bumps arranged therein is a first density, a second region where an area density of a region having bumps arranged therein is a second density lower than the first density, and a third region provided in a border portion between the first and second regions. In the third region, an area density of a region having bumps arranged therein is above the second density and below the first density.