Invention Grant
US08405208B2 Semiconductor device having semiconductor substrate electrode pads, and external electrodes
有权
具有半导体衬底电极焊盘和外部电极的半导体器件
- Patent Title: Semiconductor device having semiconductor substrate electrode pads, and external electrodes
- Patent Title (中): 具有半导体衬底电极焊盘和外部电极的半导体器件
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Application No.: US13365591Application Date: 2012-02-03
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Publication No.: US08405208B2Publication Date: 2013-03-26
- Inventor: Kunihiro Komiya
- Applicant: Kunihiro Komiya
- Applicant Address: JP
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2004-283167 20040929
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The semiconductor device has the CSP structure, and includes: a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps are arranged in two rows along the periphery of the semiconductor device. The electrode pads are arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring is extended from an electrode pad, and is connected to any one of the outermost solder bumps or any one of the inner solder bumps.
Public/Granted literature
- US20120133058A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-05-31
Information query
IPC分类:
