Invention Grant
US08405193B2 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
失效
具有气密密封边缘的有机电子封装和制造这种包装的方法
- Patent Title: Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
- Patent Title (中): 具有气密密封边缘的有机电子封装和制造这种包装的方法
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Application No.: US10817531Application Date: 2004-04-02
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Publication No.: US08405193B2Publication Date: 2013-03-26
- Inventor: Marc Schaepkens , Anil Duggal , Christian M. Heller
- Applicant: Marc Schaepkens , Anil Duggal , Christian M. Heller
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agent Fletcher Yoder
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.
Public/Granted literature
- US20050224935A1 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages Public/Granted day:2005-10-13
Information query
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