Invention Grant
- Patent Title: Solid-state imaging device, method of making the same, and imaging apparatus
- Patent Title (中): 固态成像装置及其制造方法以及成像装置
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Application No.: US13242557Application Date: 2011-09-23
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Publication No.: US08405180B2Publication Date: 2013-03-26
- Inventor: Kentaro Akiyama
- Applicant: Kentaro Akiyama
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2006-331559 20061208
- Main IPC: H01L31/0232
- IPC: H01L31/0232
Abstract:
A solid-state imaging device includes the following elements. A photoelectric conversion section is arranged in a semiconductor layer having a first surface through which light enters the photoelectric conversion section. A signal circuit section is arranged in a second surface of the semiconductor layer opposite to the first surface. The signal circuit section processes signal charge obtained by photoelectric conversion by the photoelectric conversion section. A reflective layer is arranged on the second surface of the semiconductor layer opposite to the first surface. The reflective layer reflects light transmitted through the photoelectric conversion section back thereto. The reflective layer is composed of a single tungsten layer or a laminate containing a tungsten layer.
Public/Granted literature
- US20120008026A1 SOLID-STATE IMAGING DEVICE, METHOD OF MAKING THE SAME, AND IMAGING APPARATUS Public/Granted day:2012-01-12
Information query
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