Invention Grant
- Patent Title: Semiconductor device and semiconductor device assembly
- Patent Title (中): 半导体器件和半导体器件组件
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Application No.: US13075681Application Date: 2011-03-30
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Publication No.: US08405172B2Publication Date: 2013-03-26
- Inventor: Mikio Tsujiuchi , Masayoshi Tarutani , Yosuke Takeuchi
- Applicant: Mikio Tsujiuchi , Masayoshi Tarutani , Yosuke Takeuchi
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-082465 20100331
- Main IPC: H01L29/82
- IPC: H01L29/82

Abstract:
A semiconductor device excellent in the magnetic shielding effect of blocking off external magnetic fields is provided. The semiconductor device includes: an interlayer insulating film so formed as to cover a switching element formed over a main surface of a semiconductor substrate; a flat plate-like lead wiring; a coupling wiring coupling the lead wiring and the switching element with each other; and a magnetoresistive element including a magnetization free layer the orientation of magnetization of which is variable and formed over the lead wiring. The semiconductor device has a wiring and another wiring through which the magnetization state of the magnetization free layer can be varied. In a memory cell area where multiple magnetoresistive elements are arranged, a first high permeability film arranged above the magnetoresistive elements is extended from the memory cell area up to a peripheral area that is an area other than the memory cell area.
Public/Granted literature
- US20110241140A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ASSEMBLY Public/Granted day:2011-10-06
Information query
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