Invention Grant
US08405168B2 Nanowire fabrication method and semiconductor element using nanowire fabricated thereby
有权
纳米线制造方法和使用由此制造的纳米线的半导体元件
- Patent Title: Nanowire fabrication method and semiconductor element using nanowire fabricated thereby
- Patent Title (中): 纳米线制造方法和使用由此制造的纳米线的半导体元件
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Application No.: US13017777Application Date: 2011-01-31
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Publication No.: US08405168B2Publication Date: 2013-03-26
- Inventor: Chia-Yi Lin , Min-Cheng Chen , Hou-Yu Chen
- Applicant: Chia-Yi Lin , Min-Cheng Chen , Hou-Yu Chen
- Applicant Address: TW Taipei
- Assignee: National Applied Research Laboratories
- Current Assignee: National Applied Research Laboratories
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW99143262A 20101210
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
The present invention discloses a nanowire fabrication method and a semiconductor element using a nanowire fabricated thereby. The method of the present invention comprises steps: providing a substrate; sequentially depositing a silicon dioxide layer and a silicon nitride layer on the substrate; forming a patterned photoresist layer on the silicon nitride layer; using the patterned photoresist layer as a mask to etch the silicon nitride layer and the silicon dioxide layer with the substrate partly etched away to form a protrusion; removing the patterned photoresist layer to form an isolation layer; removing the silicon nitride and the silicon dioxide layer, sequentially depositing a dielectric layer and a polysilicon layer; and anisotropically etching the polysilicon layer to form nanowires on a region of the dielectric layer, which is around sidewalls of the protrusion.
Public/Granted literature
- US20120146161A1 NANOWIRE FABRICATION METHOD AND SEMICONDUCTOR ELEMENT USING NANOWIRE FABRICATED THEREBY Public/Granted day:2012-06-14
Information query
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