Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13031910Application Date: 2011-02-22
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Publication No.: US08405143B2Publication Date: 2013-03-26
- Inventor: Chun-Hsien Lin , Chao-Ching Hsieh
- Applicant: Chun-Hsien Lin , Chao-Ching Hsieh
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L29/792
- IPC: H01L29/792

Abstract:
A semiconductor device including a substrate, a gate structure, a spacer and source/drain regions is provided. The gate structure is on the substrate, wherein the gate structure includes, from bottom to top, a high-k layer, a work function metal layer, a wetting layer and a metal layer. The spacer is on a sidewall of the gate structure. The source/drain regions are in the substrate beside the gate structure.
Public/Granted literature
- US20110140206A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-06-16
Information query
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