Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13196512Application Date: 2011-08-02
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Publication No.: US08405126B2Publication Date: 2013-03-26
- Inventor: Daisuke Shibata , Tatsuo Morita , Manabu Yanagihara , Yasuhiro Uemoto
- Applicant: Daisuke Shibata , Tatsuo Morita , Manabu Yanagihara , Yasuhiro Uemoto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-031099 20090213
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
A semiconductor device includes a semiconductor layer stack formed on a substrate, a first ohmic electrode and a second ohmic electrode which are formed on the semiconductor layer stack, and are spaced from each other, a first control layer formed between the first ohmic electrode and the second ohmic electrode, and a first gate electrode formed on the first control layer. The first control layer includes a lower layer, an intermediate layer which is formed on the lower layer, and has lower impurity concentration than the lower layer, and an upper layer which is formed on the intermediate layer, and has higher impurity concentration than the intermediate layer.
Public/Granted literature
- US20110284928A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-11-24
Information query
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