Invention Grant
- Patent Title: Insulated gate semiconductor device
- Patent Title (中): 绝缘栅半导体器件
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Application No.: US13010307Application Date: 2011-01-20
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Publication No.: US08405122B2Publication Date: 2013-03-26
- Inventor: Kenji Kouno , Yukio Tsuzuki
- Applicant: Kenji Kouno , Yukio Tsuzuki
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2010-024029 20100205; JP2010-193473 20100831
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An insulated gate semiconductor device includes a semiconductor substrate, channel regions, floating regions, an emitter region, a body region, a hole stopper layer, and an emitter electrode. The channel regions and the floating regions are repeatedly arranged such that at least one floating region is located between adjacent channel regions. The emitter region and the body region are located in a surface portion of each channel region. The body region is deeper than the emitter region. The hole stopper layer is located in each floating region to divide the floating region into a first region and a second region. The emitter electrode is electrically connected to the emitter region and the first region.
Public/Granted literature
- US20110193132A1 INSULATED GATE SEMICONDUCTOR DEVICE Public/Granted day:2011-08-11
Information query
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