Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method thereof
- Patent Title (中): 半导体存储器件及其制造方法
-
Application No.: US12659563Application Date: 2010-03-12
-
Publication No.: US08405089B2Publication Date: 2013-03-26
- Inventor: Hiroyuki Uchiyama
- Applicant: Hiroyuki Uchiyama
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2009-064798 20090317
- Main IPC: H01L21/8239
- IPC: H01L21/8239 ; H01L21/8242

Abstract:
To provide an active region having first and second diffusion layers positioned at both sides of a gate trench and a third diffusion layer formed on a bottom surface of the gate trench, first and second memory elements connected to the first and second diffusion layers, respectively, a bit line connected to the third diffusion layer, a first gate electrode that covers a first side surface of the gate trench via a gate dielectric film and forms a channel between the first diffusion layer and the third diffusion layer, and a second gate electrode that covers a second side surface of the gate trench via a gate dielectric film and forms a channel between the second diffusion layer and the third diffusion layer. According to the present invention, because separate transistors are formed on both side surfaces of a gate trench, two times of conventional integration can be achieved.
Public/Granted literature
- US20100237397A1 Semiconductor memory device and manufacturing method thereof Public/Granted day:2010-09-23
Information query
IPC分类: