Invention Grant
- Patent Title: Protective edging for a cathode of an electroplating system
- Patent Title (中): 电镀系统阴极的保护边缘
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Application No.: US13272957Application Date: 2011-10-13
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Publication No.: US08404167B1Publication Date: 2013-03-26
- Inventor: Richard W. Steen
- Applicant: Richard W. Steen
- Applicant Address: US TX Amarillo
- Assignee: Steen Enterprises, LLC
- Current Assignee: Steen Enterprises, LLC
- Current Assignee Address: US TX Amarillo
- Agency: Conley Rose, P.C.
- Agent Mark E. Scott
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/34

Abstract:
Protective edging for a cathode of an electroplating system. At least some of the illustrative embodiments a cathodes of an electroplating system, the cathodes including a sheet of metallic material that defines a front, a back and an edge, a plurality of apertures through the metallic material proximate to a portion of the edge and a plastic material that envelops the portion of the edge and the plurality of apertures. The plastic material extends through the apertures and is adhered to the metallic material.
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